Events for 1 September 2024

The Packaging Chips with CHIPS: West Coast Summit is a one-day semi summit that will bring together leading thinkers from chip packaging and design companies, along with government policy makers, to discuss the chip packaging industry in light of the historic CHIPS Act and the Materials-to-Fab Center coming to Arizona State University

IEEE UEMCON 2024 will provide an opportunity for researchers, educators, and students to discuss and exchange ideas on issues, trends, and developments in Computing, Electronics, and Mobile Communication.

Call for Papers →